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日期:2017-04-05PCB board face blister is surface binding force bad problem, again lead to the question, that is, the surface quality of the plate, which contains two aspects of content:
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日期:2016-07-08Will some bonding pad in the design of circuit board, then some not too professional design engineer will put a multilayer welding plate overlap, it will affect production, can be chosen from the following two scheme bonding pad in the design of a circuit board to avoid overlapping like now.
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日期:2016-05-28According to understand apple has added a memory chip supplier, it is China has just developed Yangtze river storage.
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日期:2016-05-24Waste circuit board is a kind of important electric and electronic waste, waste circuit board resin powder is the main product of circuit board after removal of MSW processing waste, waste disposal and resource utilization of circuit board resin powder and meets the requirement of environment protection and sustainable development.
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日期:2016-03-28multilayer circuit board assembly density, small volume, with the volume of electronic products is more and more small, the electrical properties of the PCB is also put forward higher request, demand for multilayer PCB is becoming more and more big.
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